Publications
Tagged As
A fully integrated broadband sub-mmWave chip-to-chip interconnect
Summary
Summary
A new type of broadband link enabling extremely high-speed chip-to-chip communication is presented. The link is composed of fully integrated sub-mmWave on-chip traveling wave power couplers and a low-cost planar dielectric waveguide. This structure is based on a differentially driven half-mode substrate integrated waveguide supporting the first higher order hybrid...
Fabrication process and properties of fully planarized deep-submicron Nb/Al-AlOx/Nb Josephson junctions for VLSI circuits
Summary
Summary
A fabrication process for Nb/Al-AlOx/Nb Josephson junctions (JJs) with sizes down to 200 nm has been developed on a 200-mm-wafer tool set typical for CMOS foundry. This process is the core of several nodes of a roadmap for fully-planarized fabrication processes for superconductor integrated circuits with 4, 8, and 10...
Inductance of circuit structures for MIT LL superconductor electronics fabrication process with 8 niobium layers
Summary
Summary
Inductance of superconducting thin-film inductors and structures with linewidth down to 250 nm has been experimentally evaluated. The inductors include various striplines and microstrips, their 90 degree bends and meanders, interlayer vias, etc., typically used in superconducting digital circuits. The circuits have been fabricated by a fully planarized process with...
Materials and fabrication sequences for water soluble silicon integrated circuits at the 90 nm node
Summary
Summary
Tungsten interconnects in silicon integrated circuits built at the 90 nm node with releasable configurations on silicon on insulator wafers serve as the basis for advanced forms of water-soluble electronics. These physically transient systems have potential uses in applications that range from temporary biomedical implants to zero-waste environmental sensors. Systemic...
Energy efficiency benefits of subthreshold-optimized transistors for digital logic
Summary
Summary
The minimum energy point of an integrated circuit (IC) is defined as the value of the supply voltage at which the energy per operation of the circuit is minimized. Several factors influence what the value of this voltage can be, including the topology of the circuit itself, the input activity...
Simultaneous dynamic pupil coding with on-chip coded aperture temporal imaging
Summary
Summary
We describe a new sensor that combines dynamic pupil coding with a digital readout integrated circuit (DROIC) capable of modulating a scene with a global or per-pixel time-varying, pseudo-random, and duo-binary signal (+1-1,0).
On the development of a tileable LRU for the NextGen surveillance and weather radar capability program
Summary
Summary
MIT Lincoln Laboratory is working towards the development of a tileable radar panel to satisfy multimission needs. A combination of custom and commercial off-the-shelf (COTS) Monolithic Microwave Integrated Circuits (MMICs) have been developed and/or employed to achieve the required system functionality. The integrated circuits (ICs) are integrated into a low...
A compressed sensing analog-to-information converter with edge-triggered SAR ADC core
Summary
Summary
This paper presents the design and implementation of an analog-to-information converter (AIC) based on compressed sensing. The core of the AIC is an edge-triggered charge-sharing SAR ADC. Compressed sensing is achieved through random sampling and asynchronous successive approximation conversion using the ADC core. Implemented in 90nm CMOS, the prototype SAR...
Vertically stacked RF switches by wafer-scale three-dimensional integration
Summary
Summary
Vertically stacked RF switches implemented by wafer-scale three-dimensional (3D) integration of three completely fabricated silicon-on-insulator wafers are demonstrated. The individual switch performance was maintained through the 3D integration process while the signal path is shortened by vertical interconnects. The footprint of the switch can be shrunk in proportion to the...
Readout circuitry for continuous high-rate photon detection with arrays of InP Geiger-mode avalanche photodiodes
Summary
Summary
An asynchronous readout integrated circuit (ROIC) has been developed for hybridization to a 32x32 array of single-photon sensitive avalanche photodiodes (APDs). The asynchronous ROIC is capable of simultaneous detection and readout of photon times of arrival, with no array blind time. Each pixel in the array is independently operated by...