Publications

Refine Results

(Filters Applied) Clear All

State of the art focal plane arrays of InP/InGaAsP Geiger-mode avalanche photodiodes for active electro-optical applications

Summary

MIT Lincoln Laboratory has developed InP/InGaAsP Geiger-Mode Avalanche Photodiodes and associated readout integrated circuits (ROICs) that have enabled numerous active optical systems over the past decade. Framed and asynchronous photon timing ROIC architectures have been demonstrated. In recent years, efforts at MITLL have focused on technology development to advance the state of the art of framed Gm APD FPAs and a 256x128 pixel FPA with on-chip data thinning has been demonstrated.
READ LESS

Summary

MIT Lincoln Laboratory has developed InP/InGaAsP Geiger-Mode Avalanche Photodiodes and associated readout integrated circuits (ROICs) that have enabled numerous active optical systems over the past decade. Framed and asynchronous photon timing ROIC architectures have been demonstrated. In recent years, efforts at MITLL have focused on technology development to advance the...

READ MORE

Slab-coupled optical waveguide (SCOW) devices and photonic integrated circuits (PICs)

Summary

We review recent advances in the development of slab-coupled optical waveguide (SCOW) devices, progress toward a flexible photonic integration platform containing both conventional high-confinement and SCOW ultra-low confinement devices, and applications of this technology.
READ LESS

Summary

We review recent advances in the development of slab-coupled optical waveguide (SCOW) devices, progress toward a flexible photonic integration platform containing both conventional high-confinement and SCOW ultra-low confinement devices, and applications of this technology.

READ MORE

Readout circuitry for continuous high-rate photon detection with arrays of InP Geiger-mode avalanche photodiodes

Summary

An asynchronous readout integrated circuit (ROIC) has been developed for hybridization to a 32x32 array of single-photon sensitive avalanche photodiodes (APDs). The asynchronous ROIC is capable of simultaneous detection and readout of photon times of arrival, with no array blind time. Each pixel in the array is independently operated by a finite state machine that actively quenches an APD upon a photon detection event, and re-biases the device into Geiger mode after a programmable hold-off time. While an individual APD is in hold-off mode, other elements in the array are biased and available to detect photons. This approach enables high pixel refresh frequency (PRF), making the device suitable for applications including optical communications and frequency-agile ladar. A built-in electronic shutter that de-biases the whole array allows the detector to operate in a gated mode or allows for detection to be temporarily disabled. On-chip data reduction reduces the high bandwidth requirements of simultaneous detection and readout. Additional features include programmable single-pixel disable, region of interest processing, and programmable output data rates. State-based on-chip clock gating reduces overall power draw. ROIC operation has been demonstrated with hybridized InP APDs sensitive to 1.06-Mm and 1.55-Mm wavelength, and fully packaged focal plane arrays (FPAs) have been assembled and characterized.
READ LESS

Summary

An asynchronous readout integrated circuit (ROIC) has been developed for hybridization to a 32x32 array of single-photon sensitive avalanche photodiodes (APDs). The asynchronous ROIC is capable of simultaneous detection and readout of photon times of arrival, with no array blind time. Each pixel in the array is independently operated by...

READ MORE

High-power, low-noise 1.5-um slab-coupled optical waveguide (SCOW) emitters: physics, devices, and applications

Summary

We review the development of a new class of high-power, edge-emitting, semiconductor optical gain medium based on the slab-coupled optical waveguide (SCOW) concept. We restrict the scope to InP-based devices incorporating either InGaAsP or InGaAlAs quantum-well active regions and operating in the 1.5-μm-wavelength region. Key properties of the SCOW gain medium include large transverse optical mode dimensions (>;5 × 5 μm), ultralow optical confinement factor (Γ ~ 0.25-1%), and small internal loss coefficient (α i ~ 0.5 cm-1). These properties have enabled the realization of 1) packaged Watt-class semiconductor optical amplifiers (SOAs) having low-noise figure (4-5 dB), 2) monolithic passively mode-locked lasers generating 0.25-W average output power, 3) external-cavity fiber-ring actively mode-locked lasers exhibiting residual timing jitter of
READ LESS

Summary

We review the development of a new class of high-power, edge-emitting, semiconductor optical gain medium based on the slab-coupled optical waveguide (SCOW) concept. We restrict the scope to InP-based devices incorporating either InGaAsP or InGaAlAs quantum-well active regions and operating in the 1.5-μm-wavelength region. Key properties of the SCOW gain...

READ MORE

Uni-traveling-carrier variable confinement waveguide photodiodes

Summary

Uni-traveling-carrier waveguide photodiodes (PDs) with a variable optical confinement mode size transformer are demonstrated. The optical mode is large at the input for minimal front-end saturation and the mode transforms as the light propagates so that the absorption profile is optimized for both high-power and high-speed performance. Two differently designed PDs are presented. PD A demonstrates a 3-dB bandwidth of 12.6 GHz, and saturation currents of 40 mA at 1 GHz and 34 mA at 10 GHz. PD B demonstrates a 3-dB bandwidth of 2.5 GHz, a saturation current greater than 100 mA at 1 GHz, a peak RF output power of + 19 dBm, and a third-order output intercept point of 29.1 dBm at a photocurrent of 60 mA.
READ LESS

Summary

Uni-traveling-carrier waveguide photodiodes (PDs) with a variable optical confinement mode size transformer are demonstrated. The optical mode is large at the input for minimal front-end saturation and the mode transforms as the light propagates so that the absorption profile is optimized for both high-power and high-speed performance. Two differently designed...

READ MORE

Uniformity study of wafer-scale InP-to-silicon hybrid integration

Published in:
Appl. Phys. A, Mat. Sci. & Process., Vol. 103, No. 1, April 2011, pp. 213-218.

Summary

In this paper we study the uniformity of up to 150 mm in diameter wafer-scale III-V epitaxial transfer to the Si-on-insulator substrate through the O2 plasma-enhanced low-temperature (300°C) direct wafer bonding. Void-free bonding is demonstrated by the scanning acoustic microscopy with sub-um resolution. The photoluminescence (PL) map shows less than 1 nm change in average peak wavelength, and even improved peak intensity (4% better) and full width at half maximum (41% better) after 150 mm in diameter epitaxial transfer. Small and uniformly distributed residual strain in all sizes of bonding, which is measured by high-resolution X-ray diffraction Omega- 2Theta mapping, and employment of a two-period InP-InGaAsP superlattice at the bonding interface contributes to the improvement of PL response. Preservation of multiple quantum-well integrity is also verified by high-resolution transmission electron microscopy.
READ LESS

Summary

In this paper we study the uniformity of up to 150 mm in diameter wafer-scale III-V epitaxial transfer to the Si-on-insulator substrate through the O2 plasma-enhanced low-temperature (300°C) direct wafer bonding. Void-free bonding is demonstrated by the scanning acoustic microscopy with sub-um resolution. The photoluminescence (PL) map shows less than...

READ MORE

Microwave photonic applications of slab-coupled optical waveguide devices

Published in:
2010 23rd Annual Mtg. of the IEEE Photonics Society, 10 November 2010, pp. 479-480.
Topic:

Summary

The semiconductor slab-coupled optical waveguide (SCOW) concept is a versatile device platform that has enabled new classes of high-power, low-noise single-frequency lasers, mode-locked lasers, optical amplifiers, and photodiodes for analog optical links and photonic analog-to-digital converters.
READ LESS

Summary

The semiconductor slab-coupled optical waveguide (SCOW) concept is a versatile device platform that has enabled new classes of high-power, low-noise single-frequency lasers, mode-locked lasers, optical amplifiers, and photodiodes for analog optical links and photonic analog-to-digital converters.

READ MORE

Wafer-scale 3D integration of InGaAs image sensors with Si readout circuits

Summary

In this work, we modified our wafer-scale 3D integration technique, originally developed for Si, to hybridize InP-based image sensor arrays with Si readout circuits. InGaAs image arrays based on the InGaAs layer grown on InP substrates were fabricated in the same processing line as silicon-on-insulator (SOI) readout circuits. The finished 150-mm-diameter InP wafer was then directly bonded to the SOI wafer and interconnected to the Si readout circuits by 3D vias. A 1024 x 1024 diode array with 8-um pixel size is demonstrated. This work shows the wafer-scale 3D integration of a compound semiconductor with Si.
READ LESS

Summary

In this work, we modified our wafer-scale 3D integration technique, originally developed for Si, to hybridize InP-based image sensor arrays with Si readout circuits. InGaAs image arrays based on the InGaAs layer grown on InP substrates were fabricated in the same processing line as silicon-on-insulator (SOI) readout circuits. The finished...

READ MORE

High-quality 150 nm InP-to-silicon epitaxial transfer for silicon photonic integrated circuits

Published in:
Electrochem. Solid-State Lett., Vol. 12, No. 4, January 2009, pp. H101-H104.

Summary

We demonstrate the transfer of the largest (150 mm in diameter) available InP-based epitaxial structure to the silicon-on-insulator substrate through a direct wafer-bonding process. Over 95% bonding yield and a void-free bonding interface was obtained. A multiple quantum-well diode laser structure is well-preserved after bonding, as indicated by the high-resolution X-ray diffraction measurement and photoluminescence (PL) map. A bowing of 64.12 um is measured, resulting in a low bonding-induced strain of 17 MPa. PL measurement shows a standard deviation of 1.09% across the entire bonded area with less than 1.1 nm wavelength shift from the as-grown wafer.
READ LESS

Summary

We demonstrate the transfer of the largest (150 mm in diameter) available InP-based epitaxial structure to the silicon-on-insulator substrate through a direct wafer-bonding process. Over 95% bonding yield and a void-free bonding interface was obtained. A multiple quantum-well diode laser structure is well-preserved after bonding, as indicated by the high-resolution...

READ MORE

InP-based single-photon detector arrays with asynchronous readout integrated circuits

Summary

We have developed and demonstrated a highduty- cycle asynchronous InGaAsP-based photon counting detector system with near-ideal Poisson response, roomtemperature operation, and nanosecond timing resolution for near-infrared applications. The detector is based on an array of Geiger-mode avalanche photodiodes coupled to a custom integrated circuit that provides for lossless readout via an asynchronous, nongated architecture. We present results showing Poisson response for incident photon flux rates up to 10 million photons per second and multiple photons per 3-ns timing bin.
READ LESS

Summary

We have developed and demonstrated a highduty- cycle asynchronous InGaAsP-based photon counting detector system with near-ideal Poisson response, roomtemperature operation, and nanosecond timing resolution for near-infrared applications. The detector is based on an array of Geiger-mode avalanche photodiodes coupled to a custom integrated circuit that provides for lossless readout via...

READ MORE

Showing Results

1-10 of 15