Publications
Fabrication process and properties of fully planarized deep-submicron Nb/Al-AlOx/Nb Josephson junctions for VLSI circuits
Summary
Summary
A fabrication process for Nb/Al-AlOx/Nb Josephson junctions (JJs) with sizes down to 200 nm has been developed on a 200-mm-wafer tool set typical for CMOS foundry. This process is the core of several nodes of a roadmap for fully-planarized fabrication processes for superconductor integrated circuits with 4, 8, and 10...
Inductance of circuit structures for MIT LL superconductor electronics fabrication process with 8 niobium layers
Summary
Summary
Inductance of superconducting thin-film inductors and structures with linewidth down to 250 nm has been experimentally evaluated. The inductors include various striplines and microstrips, their 90 degree bends and meanders, interlayer vias, etc., typically used in superconducting digital circuits. The circuits have been fabricated by a fully planarized process with...
Reconfigurable RF systems using commercially available digital capacitor arrays
Summary
Summary
Various RF circuit blocks implemented by using commercially available MEMS digital capacitor arrays are presented for reconfigurable RF systems. The designed circuit blocks are impedance-matching network, tunable bandpass filter, and VSWR sensor. The frequency range of the designed circuits is 0.4-4GHz. The MEMS digital capacitor arrays that are employed in...
Circuit-fed tile-approach configuration for millimeter-wave spatial power combining
Summary
Summary
In this paper, a circuit-fed spatially combined transmitter array is described for operation at 44 GHz. The array contains 256 elements where each element consists of a monolithic-microwave integrated-circuit amplifier and a circularly polarized microchip patch antenna. The array is constructed using 16-element tile-approach subarrays. Each subarray is a two...
MEMS microswitches for reconfigurable microwave circuitry
Summary
Summary
The performance is reported for a new microelectromechanical structure (MEMS) cantilever microswitch. We report on both dc- and capacitively-contacted microswitches. The dc-contacted microswitches have contact resistance of less than 1 ohm, and the RF loss of the switch up to 40 GHz in the closed position is 0.1-0.2 dB. Capacitively-contacted...
Combining-efficiency X-band spatial power-combined array using a multilayered packaging architecture
Summary
Summary
The design of a high combining-efficiency spatial power-combined array is described in this paper. A multilayered stacked stripline architecture enables a compact stable design. An array incorporating antenna active impedance and proper amplifier matching is measured with a combining efficiency of 87%, radiating 6.8 W of an available 7.8 W...
MEMs microswitch arrays for reconfigurable distributed microwave components
Summary
Summary
A revolutionary device technology and circuit concept is introduced for a new class of reconfigurable microwave circuits and antennas. The underlying mechanism is a compact MEMs cantilever microswitch that is arrayed in two-dimensions. The switches have the ability to be individually actuated. By constructing distributed circuit components from an array...
A modified transmission line model for cavity backed microstrip antennas
Summary
Summary
Spatial power combining of many MMIC amplifiers at millimeter wave frequencies using a fixed array of microstrip antenna elements places unique demands on dielectric media. The substrate must be relatively thick to allow space for MMIC placement, must provide rather high thermal conductivity to disipate MMIC heat, and be of...
45-GHz MMIC power combining using a circuit-fed, spatially combined array
Summary
Summary
We describe the design and measurement of a hybrid-circuit, tile-approach subarray for use in spatial power-combined transmitters. The subarray consists of 16 monolithic millimeter-wave integrated circuit (MMIC) amplifiers, each feeding a circularly polarized cavity-backed microstrip antenna. The average performance across the 43.5-45.5 GHz band is as follows: EIRP 18.3 dBW...
A 16-element subarray for hybrid-circuit tile-approach spatial power combining
Summary
Summary
Three designs for a 4-by-4 are described for use in a spatial power-combined transmitter. The subarrays are constructed using a hybrid-circuit, tile-approach architecture and are composed of 16 cavity-backed, proximity-coupled microstrip antennas, each fed by a 0.5 watt amplifier. Both linearly and circularly polarized subarrays have been constructed for operation...