Publications
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Megapixel CMOS image sensor fabricated in three-dimensional integrated circuit technology
Summary
Summary
In this paper a 3D integrated 1024x1024, 8um pixel visible image sensor fabricated with oxide-to-oxide wafer bonding and 2-um square 3-D-vias in every pixel is presented. The 150mm wafer technology integrates a low-leakage, deep-depletion, 100% fill factor photodiode layer to a 3.3-V, 0.35-um gate length fully depleted (FD) SOI CMOS...
Next-generation technologies to enable sensor networks
Summary
Summary
Examples are advances in ground moving target indicator (GMTI) processing, space-time adaptive processing (STAP), target discrimination, and electronic counter-countermeasures (ECCM). All these advances have improved the capabilities of radar sensors. Major improvements expected in the next several years will come from exploiting collaborative network-centric architectures to leverage synergies among individual...
Dynamic response of an electronically shuttered CCD imager
Summary
Summary
The dynamic response of an electronically shuttered charge-coupled device (CCD) imager to nanosecond voltage pulses has been investigated. Measurements show that the shutter can be dynamically opened and closed in nanosecond times. For the shutter opening, simulations indicate that the collection of photoelectrons occurs in times much shorter than that...
A constrained joint optimization approach to dynamic sensor configuration
Summary
Summary
Through intelligent integration of sensing and processing functions, the sensing technology of the future is evolving towards networks of configurable sensors acting in concert. Realizing the potential of collaborative real-time configurable sensor systems presents a number of challenges including the need to address a number of challenges including the need...
Silicon-on-insulator-based single-chip image sensors: low-voltage scientific imaging
Summary
Summary
A low-voltage (
Soft-x-ray CCD imagers for AXAF
Summary
Summary
We describe the key features and performance data of a 1024 x 1026-pixel frame-transfer imager for use as a soft-x-ray detector on the NASA X-ray observatory Advanced X-ray Astrophysics Facility (AXAF). The four-port device features a floating-diffusion output circuit with a responsivity of 20/spl mu/V/e/sup -/ and noise of about...
Summer 1992 Terminal area-Local Analysis and Prediction System (T-LAPS) evaluation
Summary
Summary
The Integrated Terminal Weather System (ITWS) is a development program initiated by the Federal Administration (FAA) to produce a fully automated, integrated terminal weather information system to improve the safety, efficiency and capacity of terminal area aviation operations. The ITWS will acquire data from FAA and National Weather Service sensors...
Mode S surveillance netting
Summary
Summary
The surveillance performance of a single Mode S Sensor is degraded by several factors, including: poor crossrange accuracy at long range, diffraction-induced azimuth errors, missing of incomplete reports, and extraneous reports. The surveillance netting project reported here sought to overcome these difficulties by employing information from a secondary (and perhaps...
Mode S Beacon System: Functional Description (Revision B)
Summary
Summary
This document provides a functional description of the Mode S Beacon System, a combined secondary surveillance radar (beacon) and ground-air-ground data link system capable of providing the aircraft surveillance and communications necessary to support ATC automation in future traffic environments. Mode S is capable of common-channel interoperation with the current...
TCAS I design guidelines
Summary
Summary
A description of the FAA airborne Traffic Alert and Collision Avoidance System known as TCAS I introduces the main topic of the report: results of an investigation of simple techniques suitable for the passive and active detection of nearby aircraft by TCAS I. This is followed by a review of...