Interconnect Structures for Fine-Pitch Assembly of Semiconductor Structures and Related Techniques

Semiconductors form the basis of modern electronics, including transistors, solar cells, diodes, and integrated circuits. Strong and reliable electrical connections are essential in such structures as faulty or weak connections may lead to device malfunction or a reduction in efficiency. Hence, a technology that ensures dependable connections in semiconductor structures is a necessity in electronics manufacturing. Current approaches may struggle with ensuring robust and efficient electrical connections in diverse, complicated semiconductor structures. The positioning and arrangement of connections significantly influence the device's effectiveness. Conventional designs may limit devices' functionality because of inadequate isolation between electrical connections. Therefore, an advanced approach to overcome these problems is critical for enhancing device reliability and performance.

Technology Description

This semiconductor structure comprises a substrate with first and second opposing surfaces along with multiple electrical connections extending between these surfaces. With one or more interconnect pads, each pad also has first and second opposing surfaces and one or more sides. The first surface is placed over or beneath selected sections of the substrate's second surface and electrically linked with select electrical connections. Additionally, the structure features an isolating layer with first and second opposing surfaces and openings in select parts, extending between its second surface and the second surfaces of the interconnect pads. Featuring an efficient arrangement, this technology aids in improved electrical interconnections in semiconductor devices. The use of interconnect pads strategically placed offers enhanced electrical coupling to the relevant electrical connections in the structure. Furthermore, the isolating layer with selectively formed openings provides effective isolation to ensure proper functioning of the device. The technology also includes a unique method of fabricating the described semiconductor structure.