Interconnect Structures for Assembly of Multilayer Semiconductor Devices

Semiconductor devices are key components in numerous electronic devices we use daily, including computers, phones, and television sets. As technology advances, so does the need for better semiconductor devices that can deliver enhanced performance and capacity. Multilayer semiconductor devices came into existence to fulfil such needs as they provide more functionality while using the same or less space. Existing methodologies and technologies may not fully cater to the increasing demand for more efficient, smaller semiconductor devices. Current approaches are limited in terms of their scalability and flexibility, with most existing semiconductor structures having uniform package pitches. This uniformity reduces the potential for customization based on the specific needs of different electronic devices and can limit the efficiency and functionality of such devices.

Technology Description

The technology is a multilayer semiconductor device composed of three main structures, each having distinct semiconductor pitches on opposing surfaces. The first structure has a first semiconductor package pitch on its second surface. The second structure possesses a second semiconductor package pitch on its first surface. Lastly, the third structure carries a distinct third semiconductor package pitch on its first surface. The second and third semiconductor structures are found at the same package level in the multilayer device. Moreover, the technology also encompasses a unique method to create such multilayer semiconductor devices. What differentiates this technology is the specialized design allowing different semiconductor structures to have different package pitches. This varied structure is innovative because it allows for increased customization to the specific requirements of a device. The second and third semiconductor structures are given at the same package level, potentially streamlining production and assembly processes.